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? 2001-2012 microchip technology inc. ds21389d-page 1 tc1410/tc1410n features latch-up protected: will withstand 500 ma reverse current input will withstand negative inputs up to 5v esd protected: 4 kv high peak output current: 0.5a wide input supply voltage operating range: - 4.5v to 16v high capacitive load drive capability: - 500 pf in 25 nsec short delay time: 30 nsec typ. consistent delay times with changes in supply voltage matched delay times low supply current - with logic 1 input: 500 a - with logic 0 input: 100 a low output impedance: 16 ? available in space-saving 8-pin msop package pinout same as tc1411/tc1412/tc1413 applications switch mode power supplies line drivers pulse transformer drive relay driver general description the tc1410/tc1410n are 0.5a cmos buffers/drivers. they will not latch-up under any conditions within their power and voltage ratings. they are not subject to damage when up to 5v of noise spiking of either polarity occurs on the ground pin. they can accept, without damage or logic upset, up to 500 ma of current of either polarity being forced back into their output. all terminals are fully protected against up to 4 kv of electrostatic discharge. as mosfet drivers, the tc1410/tc1410n can easily charge a 500 pf gate capacitance in 25 nsec with matched rise and fall times, and provide low enough impedance in both the on and off states to ensure the mosfets intended state will not be affected, even by large transients. the leading and trailing edge propagation delay times are also matched to allow driving short-duration inputs with greater accuracy. package type 8-pin msop/pdip/soic 12 3 4 v dd 5 6 7 8 out gnd v dd in nc gnd out tc1410 nc = no connection 2 6,7 inverting 2 6,7 non-inverting 12 3 4 5 6 7 8 tc1410n v dd in nc gnd v dd outgnd out note: duplicate pins must be connected together for proper operation. 0.5a high-speed mosfet drivers downloaded from: http:///
tc1410/tc1410n ds21389d-page 2 ? 2001-2012 microchip technology inc. functional block diagram effective input c = 10 pf tc1410n output input gnd v dd 300 mv 4.7v inverting non-inverting output output tc1410 downloaded from: http:///
? 2001-2012 microchip technology inc. ds21389d-page 3 tc1410/tc1410n 1.0 electrical characteristics absolute maximum ratings ? supply voltage ..................................................... +20v input voltage ...................... v dd + 0.3v to gnd C 5.0v power dissipation (t a ?? 70c) msop .......................................................... 340 mw pdip ............................................................ 730 mw soic............................................................ 470 mw storage temperature range.............. -65c to +150c maximum junction temperature ...................... +150c ? stresses above those listed under "absolute maximum ratings" may cause permanent damage to the device. these are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. pin function table symbol description v dd supply input, 4.5v to 16v input control input nc no connection gnd ground gnd ground output cmos push-pull output, common to pin 7 output cmos push-pull output, common to pin 6 v dd supply input, 4.5v to 16v dc electrical characteristics electrical specifications: unless otherwise noted, over operating temperature range with 4.5v ??? v dd ??? 16v. typical values are measured at t a = +25c, v dd ? = 16v. parameters sym min typ max units conditions input logic 1 , high input voltage v ih 2.0 v logic 0 , low input voltage v il 0 . 8v input current i in -1 1 a 0v ??? v in ??? v dd, t a = +25c -10 10 -40c ???? t a ???? +85c output high output voltage v oh v dd C 0.025 v dc test low output voltage v ol 0.025 v dc test output resistance r o 1 62 2 ? v dd = 16v, i o = 10 ma, t a = +25c 2 02 8 0 c ???? t a ???? +70c 2 02 8 - 4 0 c ???? t a ???? +85c peak output current i pk 0 . 5a v dd = 16v latch-up protection withstand reverse current i rev 0.5 a duty cycle ???? 2%, t ???? 300 sec, v dd = 16v switching time (note 1) rise time t r 2 53 5 n s e c t a = +25c 2 74 0 0 c ???? t a ???? +70c 2 94 0 - 4 0 c ???? t a ???? +85c, figure 4-1 fall time t f 2 53 5 n s e c t a = +25c 2 74 0 0 c ???? t a ???? +70c 2 94 0 - 4 0 c ???? t a ???? +85c, figure 4-1 delay time t d1 3 04 0 n s e c t a = +25c 3 34 5 0 c ???? t a ???? +70c 3 54 5 - 4 0 c ???? t a ???? +85c, figure 4-1 note 1: switching times ensured by design. downloaded from: http:///
tc1410/tc1410n ds21389d-page 4 ? 2001-2012 microchip technology inc. temperature characteristics delay time t d2 3 04 0 n s e c t a = +25c 3 34 5 0 c ???? t a ???? +70c 3 54 5 - 4 0 c ???? t a ???? +85c, figure 4-1 power supply power supply current i s 0 . 51 . 0m a v in = 3v, v dd = 16v 0 . 10 . 1 5 v in = 0v electrical specifications: unless otherwise noted, all parameters apply with 4.5v ? v dd ? 16v. parameters sym min typ max units conditions temperature ranges specified temperature range (c) t a 0+ 7 0o c specified temperature range (e) t a -40 +85 oc maximum junction temperature t j +150 oc storage temperature range t a -65 +150 oc package thermal resistances thermal resistance, 8l-msop ? ja 2 0 6o c / w thermal resistance, 8l-pdip ? ja 1 2 5o c / w thermal resistance, 8l-soic ? ja 1 5 5o c / w dc electrical characteristics (continued) electrical specifications: unless otherwise noted, over operating temperature range with 4.5v ??? v dd ??? 16v. typical values are measured at t a = +25c, v dd ? = 16v. parameters sym min typ max units conditions note 1: switching times ensured by design. downloaded from: http:///
? 2001-2012 microchip technology inc. ds21389d-page 5 tc1410/tc1410n 2.0 typical performance curves note: unless otherwise indicated, over operating temperature range with 4.5v ??? v dd ??? 16v. figure 2-1: quiescent supply current vs. supply voltage. figure 2-2: input threshold vs. supply voltage. figure 2-3: high-state output resistance vs. supply voltage. figure 2-4: quiescent supply current vs. temperature. figure 2-5: input threshold vs. temperature. figure 2-6: low-state output resistance vs. supply voltage. note: the graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. the performance characteristics listed herein are not tested or guaranteed. in some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 0 100 200 300 400 500 16 14 12 10 8 6 4 v in = 3v v in = 0v t a = +25 c i supply ( a) v dd (v) 1.1 1.2 1.3 1.4 1.5 1.6 16 14 12 10 8 6 4 t a = +25 c v dd (v) v threshold (v) v ih v il 0 10 20 30 40 50 16 14 12 10 8 6 4 v dd (v) r ds-on (ohms) t a = -40 c t a = +25 c t a = +85 c -40 -20 0 20 40 60 80 0 100 200 300 400 500 i supply ( a) v in = 3v v in = 0v v supply = 16v temperature ( c) -40 -20 0 20 40 60 80 1.1 1.2 1.3 1.4 1.5 1.6 v supply = 16v temperature ( c) v threshold (v) v ih v il 0 10 20 30 40 50 16 14 12 10 8 6 4 v dd (v) r ds-on (ohms) t a = -40 c t a = +25 c t a = +85 c downloaded from: http:///
tc1410/tc1410n ds21389d-page 6 ? 2001-2012 microchip technology inc. note: unless otherwise indicated, over operating temperature range with 4.5v ??? v dd ??? 16v. figure 2-7: rise time vs. supply voltage. figure 2-8: propagation delay vs. supply voltage. figure 2-9: rise and fall times vs. capacitive load. figure 2-10: fall time vs. supply voltage. figure 2-11: propagation delay vs. supply voltage. figure 2-12: propagation delays vs. capacitive load. 0 20 40 60 80 100 16 14 12 10 8 6 4 t a = -40 c t a = +25 c t a = +85 c v dd (v) c lo ad = 500 pf t rise (nsec) 0 20 40 60 80 100 16 14 12 10 8 6 4 t a = -40 c t a = +25 c t a = +85 c v dd (v) c lo ad = 500 pf t d1 (nsec) 0 500 1000 1500 2000 2500 3000 3500 0 20 40 60 80 100 t fall t rise t a = +25 c v dd = 16v t rise , t fall (nsec) c load (pf) 0 20 40 60 80 100 16 14 12 10 8 6 4 v dd (v) t fall (nsec) t a = -40 c c lo a d = 500 pf t a = +25 c t a = +85 c 0 20 40 60 80 100 16 14 12 10 8 6 4 v dd (v) c lo ad = 500 pf t d2 (nsec) t a = -40 c t a = +25 c t a = +85 c 0 500 1000 1500 2000 2500 3000 3500 25 29 33 37 41 45 t d2 t d1 t a = +25 c v dd = 16v c load (pf) propagation delays (nsec) downloaded from: http:///
? 2001-2012 microchip technology inc. ds21389d-page 7 tc1410/tc1410n 3.0 pin descriptions the descriptions of the pins are listed in table 3-1. table 3-1: pin function table 3.1 supply input (v dd ) the v dd input is the bias supply for the mosfet driver and is rated for 4.5v to 16v with respect to the ground pin. the v dd input should be bypassed to ground with a local ceramic capacitor. the value of the capacitor should be chosen based on the capacitive load that is being driven. a value of 1.0 f is suggested. 3.2 control input (input) the mosfet driver input is a high-impedance, ttl/cmos-compatible input. the input also has 300 mv of hysteresis between the high and low thresholds that prevents output glitching even when the rise and fall time of the input signal is very slow. 3.3 cmos push-pull output (output) the mosfet driver output is a low-impedance, cmos, push-pull style output, capable of driving a capacitive load with 0.5 a peak currents. 3.4 ground the ground pins are the return path for the bias current and for the high peak currents that discharge the load capacitor. the ground pins should be tied into a ground plane or have very short traces to the bias supply source return. pin no. symbol description 1v dd supply input, 4.5v to 16v 2 input control input 3n c no connection 4g n d ground 5g n d ground 6o u t p u t cmos push-pull output, common to pin 7 7o u t p u t cmos push-pull output, common to pin 6 8v dd supply input, 4.5v to 16v downloaded from: http:///
tc1410/tc1410n ds21389d-page 8 ? 2001-2012 microchip technology inc. 4.0 applications information figure 4-1: switching time test circuit. c l = 500 pf 0.1 f 1.0 f inverting driver non-inverting driver input v dd = 16v input output t d1 t f t r t d2 input: 100 khz, square wave, t rise = t fall ? 10 nsec output input output t d1 t f t r t d2 +5v 10% 90% 10% 90% 10% 90% v dd 0v 90% 10% 10% 10% 90% +5v v dd 0v 0v 0v 90% 4, 5 2 6, 7 1, 8 tc1410 tc1410n tc1410n tc1410 downloaded from: http:///
? 2001-2012 microchip technology inc. ds21389d-page 9 tc1410/tc1410n 5.0 packaging information 5.1 package marking information xxxxxxxx xxxxxnnn yyww 8-lead pdip (300 mil) example: tc1410 cpa057 0346 8-lead soic (150 mil) example: xxxxxxxx xxxxyyww nnn tc1410 coa0346 057 8-lead msop example: xxxxxxx ywwnnn 1410ne 346057 legend: xx...x customer-specific information y year code (last digit of calendar year) yy year code (last 2 digits of calendar year) ww week code (week of january 1 is week 01) nnn alphanumeric traceability code pb-free jedec designator for matte tin (sn) * this package is pb-free. the pb-free jedec designator ( ) can be found on the outer packaging for this package. note : in the event the full microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e downloaded from: http:///
tc1410/tc1410n ds21389d-page 10 ? 2001-2012 microchip technology inc. 8-lead plastic dual in-line (pa) ? 300 mil (pdip) b1 b a1 a l a2 p ? e eb ? c e1 n d 1 2 units inches * millimeters dimension limits min nom max min nom max number of pins n 88 pitch p .100 2.54 top to seating plane a .140 .155 .170 3.56 3.94 4.32 molded package thickness a2 .115 .130 .145 2.92 3.30 3.68 base to seating plane a1 .015 0.38 shoulder to shoulder width e .300 .313 .325 7.62 7.94 8.26 molded package width e1 .240 .250 .260 6.10 6.35 6.60 overall length d .360 .373 .385 9.14 9.46 9.78 tip to seating plane l .125 .130 .135 3.18 3.30 3.43 lead thickness c .008 .012 .015 0.20 0.29 0.38 upper lead width b1 .045 .058 .070 1.14 1.46 1.78 lower lead width b .014 .018 .022 0.36 0.46 0.56 overall row spacing eb .310 .370 .430 7.87 9.40 10.92 mold draft angle top ? 51 01 5 51 01 5 mold draft angle bottom ? 51 01 5 51 01 5 * controlling parameter notes: dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not excee d jedec equivalent: ms-001 drawing no. c04-018 .010 (0.254mm) per side. significant characteristic note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging downloaded from: http:///
? 2001-2012 microchip technology inc. ds21389d-page 11 tc1410/tc1410n 8-lead plastic small outline (oa) ? narrow, 150 mil (soic) foot angle ? 048048 15 12 0 15 12 0 ? mold draft angle bottom 15 12 0 15 12 0 ? mold draft angle top 0.51 0.42 0.33 .020 .017 .013 b lead width 0.25 0.23 0.20 .010 .009 .008 c lead thickness 0.76 0.62 0.48 .030 .025 .019 l foot length 0.51 0.38 0.25 .020 .015 .010 h chamfer distance 5.00 4.90 4.80 .197 .193 .189 d overall length 3.99 3.91 3.71 .157 .154 .146 e1 molded package width 6.20 6.02 5.79 .244 .237 .228 e overall width 0.25 0.18 0.10 .010 .007 .004 a1 standoff 1.55 1.42 1.32 .061 .056 .052 a2 molded package thickness 1.75 1.55 1.35 .069 .061 .053 a overall height 1.27 .050 p pitch 8 8 n number of pins max nom min max nom min dimension limits millimeters inches* units 2 1 d n p b e e1 h l ? c 45 ? ? a2 ? a a1 * controlling parameter notes: dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions sha ll not exceed .010 (0.254mm) per side. jedec equivalent: ms-012 drawing no. c04-057 significant characteristic note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging downloaded from: http:///
tc1410/tc1410n ds21389d-page 12 ? 2001-2012 microchip technology inc. 8-lead plastic micro small outline package (ua) (msop) d a a1 l c (f) a2 e1 e p b n 1 2 dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not .037 ref f footprint (reference) exceed .010" (0.254mm) per side. notes: drawing no. c04-111 *controlling parameter mold draft angle topmold draft angle bottom foot anglelead width lead thickness c b .003 .009 .006.012 dimension limits overall heightmolded package thickness molded package width overall length foot length standoffoverall width number of pinspitch a l e1 d a1 e a2 .016 .024 .118 bsc.118 bsc .000 .030 .193 typ. .033 min p n units .026 bsc nom 8 inches 0.95 ref -- .009 .016 0.080.22 0 0.230.40 8 millimeters* 0.65 bsc 0.85 3.00 bsc3.00 bsc 0.60 4.90 bsc .043 .031 .037.006 0.40 0.00 0.75 min max nom 1.10 0.80 0.15 0.95 max 8 -- - 15 5 - 15 5 - jedec equivalent: mo-187 0 - 8 5 5 - - 15 15 - - - - note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging downloaded from: http:///
? 2001-2012 microchip technology inc. ds21389d-page 13 tc1410/tc1410n 6.0 revision history revision d (november 2010) added a note to each package outline drawing. downloaded from: http:///
tc1410/tc1410n ds21389d-page 14 ? 2001-2012 microchip technology inc. downloaded from: http:///
? 2001-2012 microchip technology inc. ds21389d-page 15 tc1410/tc1410n product identification system to order or obtain information, e. g., on pricing or delivery, refer to the factory or the listed sales office . sales and support device: tc1410: 0.5a single mosfet driver, inverting tc1410n: 0.5a single mosfet driver, non-inverting temperature range: c = 0c to +70c e = -40c to +85c package: oa = plastic soic, (150 mil body), 8-lead oa713 = plastic soic, (150 mil body), 8-lead (tape and reel) ua = plastic micro small outline (msop), 8-lead * ua713 = plastic micro small outline (msop), 8-lead * (tape and reel) pa = plastic dip (300 mil body), 8-lead * msop package is only available in e-temp. part no. x /xx package temperature range device examples: a) tc1410coa: 0.5a single mosfet driver, soic package, 0c to +70c. b) tc1410cpa: 0.5a single mosfet driver, pdip package, 0c to +70c. c) tc1410eua713: tape and reel, 0.5a single mosfet driver, msop package, -40c to +85c. a) tc1410ncpa: 0.5a single mosfet driver, pdip package, 0c to +70c. b) tc1410nepa: 0.5a single mosfet driver, pdip package, -40c to +85c. c) tc1410neua: 0.5a single mosfet driver, msop package, -40c to +85c. data sheets products supported by a preliminary data sheet may have an errata sheet describing minor operational differences and recommended workarounds. to determine if an errata sheet exists for a particular device, please contact one of the following: 1. your local microchip sales office 2. the microchip worldwide site (www.microchip.com) please specify which device, revision of silicon and data sheet (include literature #) you are using. new customer notification system register on our web site (www.microchip.com/cn) to receive the most current information on our products. downloaded from: http:///
tc1410/tc1410n ds21389d-page 16 ? 2001-2012 microchip technology inc. notes: downloaded from: http:///
? 2001-2012 microchip technology inc. ds21389d-page 17 information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. it is your responsibility to ensure that your application meets with your specifications. microchip makes no representations or warranties of any kind whether express or implied, written or oral, statutory or otherwise, related to the information, including but not limited to its condition, quality, performance, merchantability or fitness for purpose . microchip disclaims all liability arising from this information and its use. use of microchip devices in life support and/or safety applications is entirely at the buyers risk, and the buyer agrees to defend, indemnify and hold harmless microchip from any and all damages, claims, suits, or expenses resulting from such use. no licenses are conveyed, implicitly or otherwise, under any microchip intellectual property rights. trademarks the microchip name and logo, the microchip logo, dspic, flashflex, k ee l oq , k ee l oq logo, mplab, pic, picmicro, picstart, pic 32 logo, rfpic, sst, sst logo, superflash and uni/o are registered trademarks of microchip technology incorporated in the u.s.a. and other countries. filterlab, hampshire, hi-tech c, linear active thermistor, mtp, seeval and the embedded control solutions company are registered trademarks of microchip technology incorporated in the u.s.a. silicon storage technology is a registered trademark of microchip technology inc. in other countries. analog-for-the-digital age, app lication maestro, bodycom, chipkit, chipkit logo, codeguard, dspicdem, dspicdem.net, dspicworks, dsspeak, ecan, economonitor, fansense, hi-tide, in-circuit serial programming, icsp, mindi, miwi, mpasm, mpf, mplab certified logo, mplib, mplink, mtouch, omniscient code generation, picc, picc-18, picdem, picdem.net, pickit, pictail, real ice, rflab, select mode, sqi, serial quad i/o, total endurance, tsharc, uniwindriver, wiperlock, zena and z-scale are trademarks of microchip technology incorporated in the u.s.a. and other countries. sqtp is a service mark of microchip technology incorporated in the u.s.a. gestic and ulpp are registered trademarks of microchip technology germany ii gmbh & co. & kg, a subsidiary of microchip technology inc., in other countries. all other trademarks mentioned herein are property of their respective companies. ? 2001-2012, microchip technology incorporated, printed in the u.s.a., all rights reserved. printed on recycled paper. isbn: 9781620767856 note the following details of the code protection feature on microchip devices: microchip products meet the specification cont ained in their particular microchip data sheet. microchip believes that its family of products is one of the most secure families of its kind on the market today, when used i n the intended manner and under normal conditions. there are dishonest and possibly illegal methods used to breach the code protection feature. all of these methods, to our knowledge, require using the microchip products in a manner outside the operating specif ications contained in microchips data sheets. most likely, the person doing so is engaged in theft of intellectual property. microchip is willing to work with the customer who is concerned about the integrity of their code. neither microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. code protection does not mean that we are guaranteeing the product as unbreakable. code protection is constantly evolving. we at microchip are co mmitted to continuously improvin g the code protection features of our products. attempts to break microchips code protection feature may be a violation of the digital millennium copyright act. if such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that act. microchip received iso/ts-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona; gresham, oregon and design centers in california and india. the company?s quality system processes and procedures are for its pic ? mcus and dspic ? dscs, k ee l oq ? code hopping devices, serial eeproms, microperipherals, nonvolatile memory an d analog products. in addition, microchip?s quality system for the design and manufacture of development systems is iso 9001:2000 certified. quality management s ystem certified by dnv == iso/ts 16949 == downloaded from: http:///
ds21389d-page 18 ? 2001-2012 microchip technology inc. americas corporate office 2355 west chandler blvd. chandler, az 85224-6199 tel: 480-792-7200 fax: 480-792-7277 technical support: http://www.microchip.com/ support web address: www.microchip.com atlanta duluth, ga tel: 678-957-9614 fax: 678-957-1455 boston westborough, ma tel: 774-760-0087 fax: 774-760-0088 chicago itasca, il tel: 630-285-0071 fax: 630-285-0075 cleveland independence, oh tel: 216-447-0464 fax: 216-447-0643 dallas addison, tx tel: 972-818-7423 fax: 972-818-2924 detroit farmington hills, mi tel: 248-538-2250 fax: 248-538-2260 indianapolis noblesville, in tel: 317-773-8323 fax: 317-773-5453 los angeles mission viejo, ca tel: 949-462-9523 fax: 949-462-9608 santa clara santa clara, ca tel: 408-961-6444 fax: 408-961-6445 toronto mississauga, ontario, canada tel: 905-673-0699 fax: 905-673-6509 asia/pacific asia pacific office suites 3707-14, 37th floor tower 6, the gateway harbour city, kowloon hong kong tel: 852-2401-1200 fax: 852-2401-3431 australia - sydney tel: 61-2-9868-6733 fax: 61-2-9868-6755 china - beijing tel: 86-10-8569-7000 fax: 86-10-8528-2104 china - chengdu tel: 86-28-8665-5511 fax: 86-28-8665-7889 china - chongqing tel: 86-23-8980-9588 fax: 86-23-8980-9500 china - hangzhou tel: 86-571-2819-3187 fax: 86-571-2819-3189 china - hong kong sar tel: 852-2943-5100 fax: 852-2401-3431 china - nanjing tel: 86-25-8473-2460 fax: 86-25-8473-2470 china - qingdao tel: 86-532-8502-7355 fax: 86-532-8502-7205 china - shanghai tel: 86-21-5407-5533 fax: 86-21-5407-5066 china - shenyang tel: 86-24-2334-2829 fax: 86-24-2334-2393 china - shenzhen tel: 86-755-8864-2200 fax: 86-755-8203-1760 china - wuhan tel: 86-27-5980-5300 fax: 86-27-5980-5118 china - xian tel: 86-29-8833-7252 fax: 86-29-8833-7256 china - xiamen tel: 86-592-2388138 fax: 86-592-2388130 china - zhuhai tel: 86-756-3210040 fax: 86-756-3210049 asia/pacific india - bangalore tel: 91-80-3090-4444 fax: 91-80-3090-4123 india - new delhi tel: 91-11-4160-8631 fax: 91-11-4160-8632 india - pune tel: 91-20-2566-1512 fax: 91-20-2566-1513 japan - osaka tel: 81-66-152-7160 fax: 81-66-152-9310 japan - yokohama tel: 81-45-471- 6166 fax: 81-45-471-6122 korea - daegu tel: 82-53-744-4301 fax: 82-53-744-4302 korea - seoul tel: 82-2-554-7200 fax: 82-2-558-5932 or 82-2-558-5934 malaysia - kuala lumpur tel: 60-3-6201-9857 fax: 60-3-6201-9859 malaysia - penang tel: 60-4-227-8870 fax: 60-4-227-4068 philippines - manila tel: 63-2-634-9065 fax: 63-2-634-9069 singapore tel: 65-6334-8870 fax: 65-6334-8850 taiwan - hsin chu tel: 886-3-5778-366 fax: 886-3-5770-955 taiwan - kaohsiung tel: 886-7-213-7828 fax: 886-7-330-9305 taiwan - taipei tel: 886-2-2508-8600 fax: 886-2-2508-0102 thailand - bangkok tel: 66-2-694-1351 fax: 66-2-694-1350 europe austria - wels tel: 43-7242-2244-39 fax: 43-7242-2244-393 denmark - copenhagen tel: 45-4450-2828 fax: 45-4485-2829 france - paris tel: 33-1-69-53-63-20 fax: 33-1-69-30-90-79 germany - munich tel: 49-89-627-144-0 fax: 49-89-627-144-44 italy - milan tel: 39-0331-742611 fax: 39-0331-466781 netherlands - drunen tel: 31-416-690399 fax: 31-416-690340 spain - madrid tel: 34-91-708-08-90 fax: 34-91-708-08-91 uk - wokingham tel: 44-118-921-5869 fax: 44-118-921-5820 worldwide sales and service 11/27/12 downloaded from: http:///

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